TE Connectivity 2-2822979-3
Estimated Delivery between and with free shipping.
Overnight shipping is also available.
Free Shipping
1 Year Warranty
A+ Rated On The BBB
10% Off First Order
Based In The USA
Description
TE Connectivity 2-2822979-3 is now available from Williams Automation.
If you need a specific firmware version or series for this item, please call or email us with your request. We can also provide specifications and/or a data sheet for this item upon request. Please call or email us if you need one.
We offer Overnight shipping for most items listed on our website. Please get in touch with us to confirm whether the product can ship overnight on the day of your order. Cutoff times are typically 2-3 PM EST. Lead times can range from 1 to 4 business days.
Call (803) 761-7027 if you have any questions about availability, or email us at sales@williamsautomation.com.
Body Features
- Frame Style
- Square
- Plating Material
- Gold
- Plating Thickness
- 30 µin
Configuration Features
- Grid Spacing
- .9906 x .8585 mm
- .039 x .0338 in
- Number of Positions
- 3647
Contact Features
- Contact Base Material
- Copper Alloy
- Contact Current Rating (Max)
- .5 A
- Contact Mating Area Plating Material
- Gold
- Contact Mating Area Plating Thickness
- 30
- Socket Type
- LGA 3647
Housing Features
- Centerline (Pitch)
- .8585 mm
- .9906 mm
- .0338 in
- .039 in
- Housing Color
- Black
- Housing Material
- High Temperature Thermoplastic
Industry Standards
- UL Flammability Rating
- UL 94V-0
Mechanical Attachment
- Connector Mounting Type
- Board Mount
- Heat Sink Attachment
- Without
- PCB Mounting Style
- Surface Mount Solder Ball
Operation/Application
- Circuit Application
- Signal
Other
- Comment
- Lead-Free Solderball
Packaging Features
- Packaging Method
- Tray
Product Type Features
- Connector & Contact Terminates To
- Printed Circuit Board
- Connector System
- Board-to-Board
- Product Type
- Socket
Usage Conditions
- Operating Temperature Range
- -25 – 100 °C
- -13 – 212 °F
Reviews
What our customers say
BBB 4.7 
Rating 