TE Connectivity 1551629-3

Body Features

• Offset
  • .8 mm
• Shell Plating Finish
  • Matte
• Shell Plating Material
  • Tin over Nickel

Configuration Features

• Number of Ports
  • 1
• Number of Positions
  • 5
• Panel Ground
  • Without

Contact Features

• Contact Current Rating (Max)
  • 1.8 A
• Contact Mating Area Plating Material
  • Gold
• Contact Mating Area Plating Thickness
  • .76 µm
  • 29.52 µin

Dimensions

• PCB Thickness (Recommended)
  • .031 – .039 in
  • .8 – 1. mm
• Tail Length
  • .034 in
  • .85 mm

Housing Features

• Centerline (Pitch)
  • .025 in
  • .65 mm
• Housing Color
  • Black
• Housing Material
  • Thermoplastic

Industry Standards

• Degree of Protection
  • Splashproof
• Industry Standard
  • USB 2.0
• Moisture Sensitivity Level
  • 1
• UL Flammability Rating
  • UL 94V-0

Mechanical Attachment

• Connector Mounting Type
  • Board Mount
• Locating Posts
  • Without
• Locking Feature
  • Without
• Mounting Location
  • Top
• PCB Connector Seating
  • Offset
• PCB Mount Retention Type
  • SMT Hold-Down

Operation/Application

• Circuit Application
  • Power & Signal
• Halogen Free
  • No
• Pick and Place
  • Without Pick and Place Cover
• Pick & Place Capable
  • Yes

Packaging Features

• Packaging Method
  • Package
• Packaging Quantity
  • 1000

Product Type Features

• Connector & Contact Terminates To
  • Printed Circuit Board
• Connector Style
  • Receptacle
• Connector System
  • Cable-to-Board
• Integral Locking Latch
  • Without
• LED
  • Without
• Orientation
  • Right Angle
• Product Type
  • Connector
• Size
  • Micro
• USB Type
  • A/B
• USB Version
  • 2.0

Termination Features

• Contact Termination Type
  • Surface Mount
• Termination Method
  • Surface Mount
• Termination Method to Printed Circuit Board
  • Reflow Solder

Usage Conditions

• Mating Cycles (Max)
  • 10000
• Operating Temperature Range
  • -22 – 185 °F
  • -30 – 85 °C
• Soldering Temperature (Max)
  • 260 °C
  • 500 °F